TDK Philippines Corporation.
I served as a Process Technician in Slider Engineering Dept. My job is to conduct experimental evaluation of new projects before deployed to production line. I was assigned in row machining where sliders are sliced from wafer to row bars, then tested to see defects. These row bars are then sliced in sliders with dimensions of 1mm x 1.2 mm x 400um thick. A size too small to hold by a tweezer but so powerful to read and write data on your hard drive.
Pictures taken year 2000.
Behind me are called Lapping machines. Where rowbars are grind with very fine grinding compound.
This area is for Quality Assurance inspection. These tables are equipped with high magnification microscope to check defects visible by the naked eye.
These are lapping machines too but intended for wafers in preparation for masking so that sliders will have the contour design called as landing pads or wings.
Quality Assurance table for wafer machining area.
This is a row bonding machine which is used to bond a row bar
by Maximo Ginez III